Description
III. INVASIVE ATTACKS
This module explores invasive attacks and reverse engineering techniques, focusing on ROM analysis and circuit modification.
This module will explore:
Invasive Attacks
- Invasive attack potency
- Complexity and cost
- Role in circuit analysis
Sample Preparation
- Packaging considerations
- Repackaging methods
- Wire bonding
Advanced Repackaging
- Complex scenarios
- Backside access
Wire Bonding
- Wire bonding process
- Parameters and challenges
Wire Bonding Methods
- Ball vs. wedge bonding
FIB Technology
- FIB operation
- Material removal/deposition
FIB Edit Example
- Via creation
- Metal deposition
Microprobing
- Probing setup
- Signal observation/forcing
RE Workflow
- De-processing and imaging
- Netlist extraction
- Circuit modification
ROM Analysis Introduction
- ROM analysis overview
- Bit encoding
ROM Analysis Techniques
- Layout analysis
- Circuit simulation
ROM Analysis Examples
- Case studies
- Scrambling/encryption
